Electronic system having electronic apparatus with built-in heat generating component and cooling apparatus to cool the electronic apparatus

ABSTRACT

A cooling apparatus includes a cooling module having an electrically-driven cooling device. The cooling module is adapted to couple with a portable electronic apparatus having a heat generating component and a first connector to supply power. A second connector is provided to be electrically connected to the cooling device. The second connector is connected to the first connector when it is coupled with the portable electronic apparatus to supply the cooling device with the power received from the first connector.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is based upon and claims the benefit of priorityfrom Japanese Patent Application No. 2001-029902, filed Feb. 6, 2001.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to an electronic system having anelectronic apparatus such as portable computer, and a cooling apparatusto be used by coupling with the electronic apparatus.

[0004] 2. Discussion of the Related Art

[0005] The power consumption of a portable electronic apparatus, such asa notebook computer, has been increasing due to higher processing speedsand multi-functionality of the microprocessor, and the microprocessorheat value tends to increase rapidly in proportion. Therefore, it isnecessary to improve the heat radiation from the microprocessor in orderto secure stable operation of portable computers.

[0006] As a countermeasure thereof, a conventional portable computercontains a heat sink thermally connected to the microprocessor, andthere is an electric fan to provide cooling air to the heat sink, whichcools down a hot microprocessor.

[0007] According to this conventional cooling method, as the cooling airsupplied from the electric fan becomes a cooling medium for absorbingthe heat from the microprocessor, the microprocessor cooling capacitydepends largely on the blowing capacity of the electric fan. As aresult, if the flow of cooling air is increased to enhance themicroprocessor cooling capacity, the electric fan typically increases insize. Consequently, a large space would be required inside the housingof a portable computer for installing a bulky electric fan.

[0008] In general, for a portable computer, the housing is designed tobe thin and compact because portability is a critical element forenhancing its product value. Therefore, a space for containing a largeelectric fan of a large blowing capacity or a draft air path for coolingair is too large be secured in the housing. As a result, there may be aconcern that in the conventional cooling method, the microprocessorcooling capacity may be insufficient or may reach the thermal limit.

[0009] On the other hand, it is difficult to secure an installationsection of connectors for connecting, for example, input/output devicesand a space for containing a CD-ROM drive unit, due to the thinning ofthe housing, for portable computers. Therefore, recent portablecomputers are provided with an expansion connector and can obtain anexpansion ability comparable to that of desktop computers, by connectingthis expansion connector to an expansion apparatus called a dockingstation.

[0010] The conventional expansion apparatus typically includes abox-shape apparatus main body with built-in apparatuses for functionexpansion, such as a CD-ROM drive unit, a DVD drive unit, or the like.The apparatus main body has a top face on which the housing of theportable computer is placed, and a relay connector is arranged on thistop face. The relay connector fits into the aforementioned expansionconnector when the housing is put on the top face. A mutual fitting ofthese connectors allows an electric conduction of signal path forvarious control signals, such as mutual logical address, or a data pathof the portable computer and the expansion apparatuses.

[0011] Among such kinds of expansion apparatuses, one for installing aheat sink in the apparatus main body and for cooling a heat sink withair blown by an electric fan is known. According to this expansionapparatus, when the housing of the portable computer is placed on theapparatus main body, this housing comes into contact with the heat sink.Consequently, heat conducted from the microprocessor to the housing isdissipated by heat conduction to the heat sink and borne by the flow ofcooling air radiated outside the housing. Therefore, the portablecomputer may be cooled by using the expansion apparatus, therebyenhancing the cooling function of the portable computer.

[0012] However, an extremely thin and light notebook-type portablecomputer is designed to be mobile, and adapted to receive/transmit datafrom/to a client, or for use in a presentation at the premises of aclient. Therefore, in the conventional configuration for supporting themicroprocessor cooling by means of an expansion apparatus, it isnecessary to carry all of the times a heavy and bulky expansionapparatus together with the portable computer. Consequently, it becomesimpossible to put the portable computer in a bag, or the like, and carryabout it easily, thus sacrificing its inherent portability.

[0013] In the case of just carrying solely the portable computer, themicroprocessor cooling capacity may be insufficient. Therefore,especially when the microprocessor is tasked to execute complicatedcalculations and processing, there is a fear that the temperature of themicroprocessor may exceed the operational limits. If the temperature ofthe microprocessor becomes too high, the processing speed may becomeslower, or the operation may become impossible due to thermal overload.Consequently, it becomes impossible to completely utilize all of theperformance features of the microprocessor.

BRIEF SUMMARY OF THE INVENTION

[0014] The present invention has been devised based on such a situationand provides an electronic system capable of obtaining a desired coolingperformance without sacrificing the portability, and a cooling apparatusused for a portable electronic system, such as a notebook computer.

[0015] Additional objects and advantages of the invention will be setforth in the description which follows, and in part will be obvious fromthe description, or may be learned by practice of the invention. Theobjects and advantages of the invention may be realized and obtained bymeans of the instrumentalities and combinations particularly pointed outhereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in andconstitute a part of the specification, illustrate embodiments of theinvention, and together with the general description given above and thedetailed description of the embodiments given below, serve to explainthe principles of the invention.

[0017]FIG. 1 is a perspective view of an electronic system having aportable computer, a cooling apparatus, and an expansion apparatusaccording to an embodiment of the present invention;

[0018]FIG. 2 is a perspective view of the electronic system showing astate where the portable computer and the cooling apparatus areseparated;

[0019]FIG. 3 is a cross-sectional view of the electronic system showinga state where the portable computer and the cooling apparatus areseparated;

[0020]FIG. 4 is a perspective view of the portable computer showing astate where a cover is attached to a bottom wall of a housing;

[0021]FIG. 5 is a perspective view of the portable computer showing apositional relation between a heat conductive sheet and a heatconnection surface of a first heat sink in a state where the cover isdetached from the bottom wall of the housing;

[0022]FIG. 6 is a perspective view of a cooling apparatus;

[0023]FIG. 7 is a cross-sectional view of the electronic system showinga state where the portable computer and the cooling apparatus arelinked;

[0024]FIG. 8 is a cross-sectional view of the electronic apparatussystem showing a positional relation between a first cooling module inthe cooling apparatus and a cooling unit in the housing, in a statewhere the portable computer and the cooling apparatus are linked;

[0025]FIG. 9 is a perspective view of the cooling apparatus showing apositional relation between a second heat sink and an operationmechanism;

[0026]FIG. 10 is a plan view of the cooling apparatus showing apositional relation between a slider slid to a second position, a firstcooling module, and a switch operation lever;

[0027]FIG. 11 is a plan view of the cooling apparatus showing apositional relation between a slider slid to a first position, the firstcooling module, and the switch operation lever;

[0028]FIG. 12 is a side view of the electronic system schematicallyshowing the state where the portable computer and the cooling apparatusare linked;

[0029]FIG. 13 is a perspective view of the electronic system showing astate where the portable computer and an expansion apparatus are linked;

[0030]FIG. 14 is a perspective view of the electronic system showing astate where the portable computer and the expansion apparatus areseparated;

[0031]FIG. 15 is a cross-sectional view of the electronic system showinga state where the portable computer and the expansion apparatus areseparated;

[0032]FIG. 16 is a cross-sectional view of the electronic system showinga positional relation between the cooling unit of the portable computerand the second cooling module of the expansion apparatus;

[0033]FIG. 17 is a cross-sectional view of the electronic system showinga state where the portable computer and the expansion apparatus arelinked;

[0034]FIG. 18 a plan view of the second cooling module housed inside abase; and

[0035]FIG. 19 is a side view of the electronic system schematicallyshowing a state where the portable computer and the expansion apparatusare linked.

DETAILED DESCRIPTION

[0036] Now, an embodiment of the present invention will be describedbased on the drawings applied to a portable computer.

[0037] As shown in FIG. 1, an electronic system includes a portablecomputer 1 as an electronic apparatus, a cooling apparatus 2 for coolingof the portable computer 1, and an expansion apparatus 3 to be used forexpanding the functionality of the portable computer 1.

[0038] As shown in FIG. 2, the portable computer 1 is constituted by acomputer main body 5 and a display unit 6 supported by the computer mainbody 5. The computer main body 5 includes a housing 7. The housing 7(shown in FIG. 1) is a flat box-shape having a bottom wall 7 a, a topwall 7 b, a front wall 7 c, right and left side walls 7 d, and a backwall 7 e.

[0039] The top wall 7 b of the housing 7 has a palm rest 8 and akeyboard attachment section 9. The palm rest 8 extends in the widthdirection of the housing 7 in a forward half section of the housing 7.The keyboard attachment section 9 is positioned behind the palm rest 8and a keyboard 11 is installed on the keyboard attachment section 9.

[0040] The display unit 6 includes a display housing 12 and a liquidcrystal panel 13 housed in the display housing 12. The liquid crystalpanel 13 is exposed outward through an opening 14 at the front face ofthe display housing 12. The display housing 12 is linked with a rear endsection of the housing 7 through a hinge device (not shown). Therefore,the display unit 6 can rotate from a closed position where it is pusheddown so as to cover the palm rest 8 and the keyboard 11 from the top, toan open position where it is erected so as to expose the keyboard 11 andthe liquid crystal panel 13.

[0041] As shown in FIG. 3, the housing 7 contains a circuit board 16.The circuit board 16 has a lower surface facing to the bottom wall 7 a,and a first expansion connector 17 is mounted on the rear end section ofthe lower surface of the circuit board 16. The first expansion connector17 is opposed to a connector connection port 18 (shown in FIG. 4)opening on the bottom wall 7 a. The connector connection port 18 iscovered with a shutter 19 that can open and close.

[0042] As shown in FIG. 4, a power supply connector 21 is arranged atthe right end section of the back wall 7 e of the housing 7. The powersupply connector 21 is for connecting a power supply cord (not shown).The power supply connector 21 is mounted on the circuit board 16, and iselectrically connected to a power supply circuit on the circuit board16.

[0043] A battery pack 22 serving as a power supply during carriage ofthe portable computer is supported detachably on the middle section ofthe back wall 7 e of the housing 7. The battery pack 22 is electricallyconnected to the power supply circuit on the circuit board 16.

[0044] A semiconductor package 23 as a heat generating component ismounted on the lower face of the circuit board 16. The semiconductorpackage 23 may have a microprocessor at the center of the portablecomputer 1, and may have an IC chip 24 generating heat during theoperation. When processing multimedia information such as character,sound, and images at high speeds, the IC chip 24 generates a largeamount of heat. Therefore, the semiconductor package 23 requires coolingin order to maintain a safe operational temperature.

[0045] As shown in FIG. 3 and FIG. 8, the housing 7 has a built-incooling unit 25 for cooling down the semiconductor package 23. Thecooling unit 25 includes a first heat sink 26 and an electric fan 27.The first heat sink 26 is constituted by a metal material excellent inheat conductivity, such as aluminum alloy, for example. The first heatsink 26 includes a flat plate shape having a heat receiving portion 28and a heat exchanging portion 29. The first heat sink 26 is arrangedalong the bottom wall 7 a of the housing 7 and a plurality of pointsthereof are fixed to the bottom wall 7 a and the circuit board 16through screws 30.

[0046] The heat receiving portion 28 is opposed to the semiconductorpackage 23. The heat receiving portion 28 is thermally connected to theIC chip 24 of the semiconductor package 23 through a heat dissipationplate 31 and grease 32. The heat receiving portion 28 has a flat heatconnection surface 34 at the side opposed to the semiconductor package23. The heat connection surface 34 is adjacent to the bottom wall 7 a ofthe housing 7, and is covered with a soft heat conductive sheet 35 as aheat connection section.

[0047] As shown in FIG. 5, the heat receiving portion 28 of the firstheat sink 26 includes a first connector 36. The first connector 36 has aplurality of connection terminals 37 including power supply terminals,ground terminals, signal terminals for fan control, and signal terminalsfor recognizing the coupling of the cooling apparatus 2. Theseconnection terminals 37 are arranged and aligned in a row at a positionadjacent to the heat connection surface 34. The first connector 36 iselectrically connected to the circuit board 16 through a cable 38 (shownin FIG. 12), and the power supply and various signals are supplied fromthis circuit board 16.

[0048] As shown in FIG. 8, the heat exchanging portion 29 is integratedwith the heat receiving portion 28 and thermally connected to the heatreceiving portion 28. The heat exchanging portion 29 has a cooling airpassage 40. The cooling air passage 40 communicates with a cooling airexit 41 opening on the left side wall 7 d of the housing 7.

[0049] As obvious from FIG. 3, the aforementioned electric fan 27 ispositioned in front of the first heat sink 26. The electric fan 27includes a fan casing 45 and a centrifuge impeller 46. The fan casing 45is integrated with the first heat sink 26 and has a first suction port47, a second suction port 48, and a discharge port 49. The first suctionport 47 is opposed to a plurality of first air intake ports 51 openingat the bottom wall 7 a of the housing 7. The second suction port 48 ispartially opposed to a plurality of second air intake ports 52 openingon the palm rest 8. The discharge port 49 is opened toward the firstheat sink 26 and the semiconductor package 23, and a part thereof isopposed to the upstream end of the cooling air passage 40.

[0050] The impeller 46 is supported on the fan casing 45 through a flatmotor 53 and positioned between the aforementioned first suction port 47and second suction port 48. The flat motor 53 is rotated based on asignal supplied from the circuit board 16 when the temperature of thesemiconductor package 23 reaches a predetermined value.

[0051] When the impeller 46 is rotated by driving through the flat motor53, air is pulled from the first and second suction ports 47, 48 towardthe impeller 46. This air is discharged from the outer periphery of theimpeller 46 and delivered to the cooling air passage 40 and thesemiconductor package 23 through the discharge port 49.

[0052] As obvious from FIG. 3 to FIG. 5, the bottom wall 7 a of thehousing 7 has an opening 55. The opening 55 is positioned in the latterhalf section of the bottom wall 7 a so as to correspond to the heatconnection surface 34 of the first heat sink 26. The opening 55 has anopening shape larger than the heat connection surface 34. This opening55 is covered with a cover 56. The cover 56 has a flat plate shape tofit correctly into the opening 55, and is fixed to the bottom wall 7 athrough a screw 57.

[0053] The cover 56 has a plurality of through holes 58 and a connectordeliver port 59. The through holes 58 are arranged in a matrix, and theheat conductive sheet 35 is exposed outside the housing 7 through thesethrough holes 58. The connector delivery port 59 is opposed to the firstconnector 36, and the connection terminals 37 of the first connector 36is exposed outside the housing 7 through this connector delivery port59.

[0054] As shown in FIG. 2, FIG. 3 and FIG. 6, the cooling apparatus 2for cooling the portable computer 1 includes a flat box-shape apparatusmain body 61. The apparatus main body 61 has a bottom wall 61 a, a topwall 61 b, a front wall 61 c, right and left side walls 61 d and a backwall 61 e and is defined to a size corresponding to the latter halfsection of the aforementioned housing 7. Therefore, the apparatus mainbody 61 is set to a size approximately half of the housing 7. The shapeof its top wall 61 b has a rectangular shape extending in the widthdirection of the housing 7.

[0055] The apparatus main body 61 has a flat rest section 62. The restsection 62 is the one where the latter half section of the housing 7rests detachably, and is constituted by the top wall 61 b of theapparatus main body 61. The rest section 62 is inclined downwardgradually from the rear end to the front end thereof, when the apparatusmain body 61 is put on a horizontal installation surface 63 such as desktop, for example. As a result, when the housing 7 of the portablecomputer 1 is put on the rest section 62, as shown in FIG. 7, theportable computer 1 is inclined to a posture where the side of the palmrest 8 and the keyboard 11 becomes low, thereby improving themanipulability during the input operation.

[0056] A pair of fixing hooks 64 a, 64 b are arranged at the rear end ofthe rest section 62. The fixing hooks 64 a, 64 b are separated from eachother in the width direction of the rest section 62, and the rear endsection of the bottom wall 7 a of the housing 7 is detachably hooked tothese fixing hooks 64 a, 64 b.

[0057] A pair of movable hooks 65 a, 65 b are arranged at the front endof the rest section 62. The movable hooks 65 a, 65 b are arrangedseparately from each other in the width direction of the rest section62. These movable hooks 65 a, 65 b are supported slidably forward andbackward from a lock position to be hooked respectively to the bottomwall 7 a of the housing 7, and an unlock position disengaging from thebottom wall 7 a.

[0058] A cooperation hook 66 is arranged in a middle section along thewidth direction of the rest section 62. The cooperation hook 66 has anarm section 67 (shown in FIG. 10 or FIG. 11) along the bottom wall 61 aof the apparatus main body 61. The arm section 67 is supported rotatablyby the bottom wall 61 a of the apparatus main body 61 at the end sectionopposite to the cooperation hook 66. Therefore, the cooperation hook 66is rotatable forward and backward from a lock position (shown in FIG.11) to be hooked to the bottom wall 7 a of the housing 7, and an unlockposition (shown in FIG. 10) disengaging from this bottom wall 7 a.

[0059] As shown in FIG. 3, FIG. 8 and FIG. 9, the apparatus main body 61has a built-in first cooling module 70. The first cooling module 70 isconfigured to cool the semiconductor package 23 in cooperation with thecooling unit 25 of the portable computer 1. The first cooling module 70includes a second heat sink 71 and an electric fan 72 as a coolingdevice to be driven electrically.

[0060] The second heat sink 71 is constituted by a metal materialexcellent in heat conductivity, such as aluminum alloy, for example.This second heat sink 71 has a flat plate shape having a heat receivingportion 73 and a heat exchanging portion 74. The second heat sink 71 isarranged in parallel to the rest section 62 of the apparatus main body61 at a position shifted to the left from the middle section along thewidth direction of the apparatus main body 61.

[0061] The heat receiving portion 73 and the heat exchanging portion 74are arranged in the longitudinal direction of the apparatus main body61, and positioned on the same plane to each other. The heat receivingportion 73 faces a square opening 75 opened in the top wall 61 b of theapparatus main body 61. As a result, the heat receiving portion 73 ispositioned under the heat connection surface 34 of the aforementionedfirst heat sink 26, when the housing 7 is put on the rest section 62.

[0062] A plurality of heat receiving convex sections 77 are formedintegrally on the top face of the heat receiving portion 73. The heatreceiving convex section 77 has a prism shape that may be inserted intothe through hole 58 of the cover 56 respectively. These heat receivingconvex sections 77 are ejected vertically from the top face of the heatreceiving portion 73 and arranged in a matrix. The tip of the heatreceiving convex section 77 includes a flat contact surface 77 a. Theseflat contact surfaces 77 a are positioned on the same plane.

[0063] The heat exchanging portion 74 is positioned behind the heatreceiving portion 73. A cooling air passage 78 is formed at the rear endsection of the heat exchanging portion 74. The cooling air passage 78extends in the width direction of the apparatus main body 61, and has acooling air intake port 79 and a cooling air discharge port 80, as shownin FIG. 8. The cooling air intake port 79 is opened inside the apparatusmain body 61. The cooling air discharge port 80 is positioned at theside opposite to the cooling air intake port 79, and faces a cooling airoutlet 81 opened on the left side wall 61 of the apparatus main body 61.

[0064] As shown in FIG. 3 and FIG. 9, the heat receiving portion 73 ofthe second heat sink 71 is provided with a second connector 83. Thesecond connector 83 has a plurality of pin shaped connection terminals84 including power supply terminals, ground terminals, signal terminalsfor fan control, and signal terminals for recognizing the coupling ofthe cooling apparatus 2. These connection terminals 84 are arranged andaligned in a row at the front end section of the heat receiving portion73. These connection terminals 84 are constituted so as to face theconnection terminals 37 of the first connector 36, when the housing 7 isput on the aforementioned rest section 62.

[0065] As shown in FIG. 10, a cable 85 connected to the second connector83 is electrically connected to a relay substrate 86. The relaysubstrate 86 is fixed is to the right end section of the bottom wall 61a of the apparatus main body 61.

[0066] As obvious from FIG. 8 to FIG. 10, the aforementioned electricfan 72 is independent from the second heat sink 71, and is positioned atthe middle section along the width direction of the apparatus main body61. The electric fan 72 includes a fan casing 88 and a centrifuge typeimpeller 89 housed in this fan casing 88.

[0067] The fan casing 88 is fixed to the bottom wall 61 a of theapparatus main body 61, at the right of the second heat sink 71. Thisfan casing 88 has a first suction port 90, a second suction port 91, anda discharge port 92.

[0068] The first suction port 90 faces a first draft hole 93 opened onthe bottom wall 61 a of the apparatus main body 61. The first draft hole93 has an opening shape larger than the fan casing 88 and is coveredwith a net shaped fan cover 94. The second suction port 91 faces aplurality of second draft holes 95 opened on the rest section 62. Thesecond draft holes 95 are configured to face the bottom wall 7 a of thehousing 7, when the housing 7 of the portable computer 1 rests on therest section 62. The discharge port 92 is opened toward the cooling airintake port 79 of the cooling air passage 78.

[0069] The impeller 89 is supported on the fan casing 88 through a flatmotor 96 and positioned between the first and second intake ports 90,91. The flat motor 96 has a cable 97 (shown in FIG. 10 and FIG. 11)pulled outward the fan casing 88. This cable 97 is connected to therelay substrate 86.

[0070] A switch 100 is mounted on the relay substrate 86. The switch 100has an operation lever 101 for opening/closing a circuit forelectrically connecting the cables 85, 97. When the circuit on the relaysubstrate 86 is closed through this operation lever 101, the secondconnector 83 and the flat motor 96 become electrically conductive.Therefore, the flat motor 96 is supplied with power supply voltage andvarious signals from the second connector 83.

[0071] As shown in FIG. 9, the bottom wall 61 a of the apparatus mainbody 61 has four boss sections 103 a to 103 d protruding upward. Theboss sections 103 a to 103 d are slidably inserted into four guide holes104 a to 104 d opened in the second heat sink 71. Consequently, thesecond heat sink 71 is held vertically movable on the bottom wall 61 aof the apparatus main body 61 taking the boss sections 103 a to 103 d asguide.

[0072] A cover plate 106 is affixed at the top end of the boss sections103 a to 103 d through a plurality of screws 105. The cover plate 106covers a part of the heat receiving portion 73 and heat exchangingportion 74 from the top, and is exposed to the rest section 62 throughthe aforementioned opening 75. The cover plate 106 has an opening 107avoiding the aforementioned heat receiving convex sections 77 and thesecond connector 83. Consequently, the second heat sink 71 is interposedbetween the bottom wall 61 a of the apparatus main body 61 and the coverplate 106, and pushed up toward the cover plate 106 by compression coilsprings 108.

[0073] As shown in FIG. 3, in a state where the second heat sink 71 ispushed up by the compression coil springs 108, the heat receiving convexsections 77 are ejected from the opening 107, and the contact surface 77a of these heat receiving convex sections 77 project over the restsection 62. When the heat receiving convex sections 77 are pushed down,the second heat sink 71 goes down in a way to approach the bottom wall61 a, and the compression coil springs 108 are compressed.

[0074] Thereby, the second heat sink 71 is vertically movably supportedby the apparatus main body 61 from a thermal connection position whereinthe contact surface 77 a of the heat receiving convex sections 77projects over the rest section 62 to a housing position where thecontact surface 77 a of the heat receiving convex sections 77 sinks to aposition approximately flush with the top face of the rest section 62.

[0075] As shown in FIG. 9 to FIG. 11, the apparatus main body 61 has abuilt-in operation mechanism 110 for moving vertically the second heatsink 71 to the thermal connection position or housing position. Theoperation mechanism 110 has first to third cogs 111 a to 111 c and aslider 112 for rotating these first to third cogs 111 a to 111 c.

[0076] The first to third cogs 111 a to 111 c are supported rotatably inthe axial direction on three boss sections 113 protruding from thebottom wall 61 a. The first cog 111 a is positioned at the heat exchangeportion 74 of the second heat sink 71. The second cog 111 b and thethird cog 111 c are positioned at the heat receiving portion 73 of thesecond heat sink 71. These cog 111 b and 111 c are separated in thewidth direction of the apparatus main body 61 across the heat receivingconvex sections 77 therebetween. Moreover, the first to third cogs 111 ato 111 c have a flange section 114 at their top end respectively. An endcam 115 is formed at the bottom face of the flange section 114.

[0077] The second heat sink 71 has three circular insertion holes 117 atpositions corresponding to the first to third cogs 111 a to 111 c. Theinsertion hole 117 has a diameter larger than the flange section 114 ofthe first to third cogs 111 a to 111 c. A cam receiving section 118projecting radially inside is formed on the inner circumferentialsurface of the respective insertion holes 117. The cam receiving section118 is slidably in contact with the end cam 115 of the flange section114.

[0078] As shown in FIG. 10 and FIG. 11, the aforementioned slider 112 issupported by the bottom wall 61 a slidably in the width direction of theapparatus main body 61. The slider 112 has a strip shape extending inthe width direction of the apparatus main body 61 and a finger hooksection 119 exposed to the bottom wall 61 a of the apparatus main body61 at the right end section thereof.

[0079] The slider 112 has a rack section 121 as shown in FIG. 9 at theleft end section thereof. The rack section 121 penetrates under thesecond heat sink 71, and is introduced between the first to third cogs111 a to 111 c. The rack section 121 has first to third rack teeth 122 ato 122 c. The first to third rack teeth 122 a to 122 c mesh with thefirst to third cogs 111 a to 111 c respectively. Consequently, when theslider 112 slides, the linear movement of this slider 112 is convertedinto rotation movement and conducted to the first to third cogs 111 a to111 c, and these first to third cogs 111 a to 111 c are configured tocooperate and rotate around the axis over a predetermined angular range.

[0080] When the first to third cogs 111 a to 111 c rotate, the relativepositional relation between the end cam 115 and the cam receivingsection 118 of the second heat sink 71 varies. To be more specific, theend cam 115 is continuously inclined so as to project under the flange114. Therefore, when the cam receiving section 118 comes into contactwith the portion of minimum downward projection of the end cam 115, thesecond heat sink 71 is pushed up to the heat connection position underthe energizing force of the compression coil springs 108. On thecontrary, when the cam receiving section 118 comes into contact with theportion of maximum downward projection of the end cam 115, the secondheat sink 71 receives a force for pressing toward the bottom wall 61 aagainst the energizing force of the compression coil springs 108.Thereby, the second heat sink 71 goes down to the housing position.

[0081] Given this, the slider 112 is supported by the apparatus mainbody 61 linearly slidably from a first position for pushing up thesecond sink 71 to the heat connection position (shown in FIG. 11) and asecond position for submerging the second heat sink 71 to the housingposition (shown in FIG. 10).

[0082] The slider 112 traverses over the arm section 67 of thecooperation hook 66, and the slider 112 has a slit shape cam hole 123 ata position corresponding to the arm section 67. The arm section 67 has apin shape guide projection 124 protruding upward. The guide projection124 is slidably inserted into the cam hole 123. Therefore, the armsection 67 of the cooperation hook 66 is constituted so as to rotateforcibly based on the shape of the cam hole 123 when the slider 112 isslid. Thereby, the cooperation hook 66 moves to the lock position shownby FIG. 11 when the slider 112 is slid to the first position, and movesto the unlock position shown by FIG. 10 when this slider 112 is slid tothe second position.

[0083] The right end section of the slider 112 is positioned just beforethe aforementioned relay substrate 86. A pressure section 126 is formedintegrally with the right end section of this slider 112. The pressuresection 126 presses the operation lever 101 of the aforementioned switch100, when the slider 112 is slid to the first position shown in FIG. 11.This pressure closes the switch 100 and connects electrically theelectric fan 72 and the second connector 83.

[0084] The pressure section 126 is disengaged from the operation lever101 of the switch 100 when the slider 112 is slid to the second positionshown in FIG. 10. Thereby, the operation lever 101 returns to the homeposition to open the switch 100, and interrupts the electricalconnection between the electric fan 72 and the second connector 83.

[0085] The aforementioned expansion apparatus 3 for expanding thefunction of the portable computer 1 is detachably coupled with theportable computer 1 in exchange to the aforementioned cooling apparatus2. This expansion apparatus 3 is provided with a flat box-shape base 150as shown in FIG. 13 and FIG. 14. The base 150 has a bottom wall 150 a, atop wall 150 b, a front wall 150 c, right and left side walls 150 d, anda back wall 150 e, and is defined to a size corresponding to the housing7 of the portable computer 1. The base 150 is provided with a restsection 151 where the housing 7 is put detachably. The rest section 151is constituted by the upper wall 150 b of the base 150, and has a sizeapproximately equal to the bottom wall 7 a of the housing 7.

[0086] The base 150 has a DVD drive unit 152 and a circuit board 153(shown in FIG. 18 and FIG. 19) inside. The DVD drive unit 152 is anelement for expanding the function of the portable computer 1 andelectrically connected to the circuit board 153. The circuit board 153is arranged in parallel to the bottom wall 150 a at the rear section ofthe base 150, and a second expansion connector 155 is mounted on the topface of the circuit board 150. The second expansion connector 155projects on the rest section 151.

[0087] Therefore, if the housing 7 of the portable computer 1 is put onthe rest section 151, as shown schematically in FIG. 19, the firstexpansion connector 17 and the second expansion connector 155 engagewith each other. Thereby, the portable computer 1 and the expansionapparatus 3 are electrically connected through the first and secondexpansion connectors 17, 155, and the signal path of various controlsignals, such as logic address, or data bus of them both becomeselectrically conductive.

[0088] Further, a power supply connector (not shown) is mounted on therear end section of the circuit board 153. The power supply connector isconfigured to connect a power supply cord and is exposed on the rearwall 150 e of the base 150. The power supply connector is electricallyconnected to the power supply circuit on the circuit substrate 153.

[0089] As shown in FIG. 14, a pair of guide protrusions 156 a, 156 b tobe engaged detachably with the front wall 7 c of the housing 7 arearranged at the front end of the rest section 151. Further, a pair oflock levers 157 a, 157 b are arranged at the rear end of the restsection 151. The lock levers 157 a, 157 b are constituted so as to lockthe portable computer 1 on the rest section 151. The lock levers 157 a,157 b are supported on the base 150 movably between a lock position toengage with the bottom wall 7 a of the housing 7 of the portablecomputer 1, and an unlock position to separate from the bottom wall 7 a.

[0090] As shown in FIG. 15 to FIG. 17, the base 150 has a built-insecond cooling module 161. The second cooling module 161 is constitutedso as to support the cooling of the portable computer 1 and includes athird heat sink 162 and an electric fan 163.

[0091] The third heat sink 162 is constituted by a metal materialexcellent in heat conductivity, such as aluminum alloy, for example, andhas a flat plate shape. The third heat sink 162 is arranged in parallelto the bottom wall 150 a of the base 150, and a pedestal section 164projecting upward is formed integrally with the top face thereof. Thepedestal section 164 is exposed on the rest section 151 through anopening 165 opened at the top wall 150 b. Consequently, the pedestalsection 164 is positioned under the heat connection surface 34 of theaforementioned first heat sink 26, when the housing 7 of the portablecomputer 1 is put on the rest section 151.

[0092] The pedestal section 164 has integrally a plurality of heatreceiving convex sections 166. The heat receiving convex sections 166form respectively a prism that may be inserted into the through hole 58of the aforementioned cover 56. The heat receiving convex sections 166are arranged in a matrix, and project vertically from the top face ofthe pedestal 164. The tip of each heat receiving convex section 166includes a flat contact surface 166 a. These contact surfaces 166 a arepositioned on a same plane.

[0093] As shown in FIG. 15 and FIG. 16, the third heat sink 162 has acooling air passage 167. The cooling air passage 167 is positioned underthe heat receiving convex sections 166. The cooling air passage 167 hasa cooling air outlet 168 opened toward the left side wall 150 d of thebase 150. The cooling air outlet 168 communicates with an exhaust port169 opened on the side wall 150 d.

[0094] A plurality of slide guides 171 are supported vertically slidableby the third heat sink 162. The slide guides 171 are positioned aroundthe aforementioned pedestal 164. These slide guides 171 are fixed to aplurality of boss sections 172 projecting upward from the bottom wall150 a through screws 173. A plurality of compression coil springs 174are interposed between the lower end of the slide guides 171 and thebottom face of the third heat sink 162. The compression coil springs 174push up the third heat sink 162 towards the rest section 151.

[0095] Consequently, when the third heat sink 162 is pressed downward,the compression coil springs 174 are compressed, and the third heat sink162 goes down in a way to approach the bottom wall 150 a of the base 150along the slide guides 171. Thereby, the third heat sink 162 isvertically movable from a thermal connection position wherein the heatreceiving convex sections 166 projects over the rest section 151 to ahousing position where the pedestal section 164 goes down inside thebase 150, and is always held at the thermal connection position.

[0096] As shown in FIG. 16, the aforementioned electric fan 163 ispositioned at the side opposed to the aforementioned cooling air outlet168 across the cooling air passage 167. The electric fan 163 includes afan casing 176 and a centrifuge-type impeller 177. The fan casing 176 isintegrated with the third heat sink 162. The fan casing 176 has a firstsuction port 178, a second suction port 179, and a discharge port 180.The first suction port 178 faces a plurality of first air inlet ports181 opened at the bottom wall 150 a. The second suction port 179 faces aplurality of second air inlet ports 182 opened on the top wall 150 b.The discharge port 180 communicates with the upstream end of the coolingair passage 167.

[0097] The impeller 177 is supported on the fan casing 176 through aflat motor 183. The flat motor 183 has a cable 185 (shown in FIG. 18 andFIG. 19) pulled outside the fan casing 176. The cable 185 includes asignal line for supplying power supply voltage, and a signal line forcarrying a signal for controlling the rotation of the impeller 177. Thecable 185 is electrically connected to the aforementioned circuit board153.

[0098] The flat motor 183 is rotated when the temperature of thesemiconductor package 23 reaches a predetermined value. When theimpeller 177 is rotated by driving the flat motor 183, air is pulledfrom the first and second suction inlets 178, 179 toward the impeller177. The air is discharged from the outer circumferential section of theimpeller 177, and delivered to the cooling air passage 167 through thedischarge port 180.

[0099] Now, the procedures to use by coupling the portable computer 1with the cooling apparatus 2 will be explained.

[0100] First, the slider 112 (see FIG. 10 and FIG. 11) of the coolingapparatus 2 is slid to the second position. So long as this slider 112is in the second position, the second heat sink 71 goes down to thehousing position and the cooperation hook 66 is held in the unlockposition.

[0101] In this state, the fixing hooks 64 a, 64 b positioned at the rearend of the rest section 62 are engaged with the bottom wall 7 a of thehousing 7, and the cooling apparatus 2 and the housing 7 are rotated ina direction for approaching each other taking the engagement section ofthis fixing hook 64 a, 64 b and the bottom wall 7 a as fulcrum. Thisrotation engages movable hooks 65 a, 65 b with the bottom wall 7 a, andthe housing 7 of the portable computer 1 is coupled with the restsection 62 of the cooling apparatus 2.

[0102] Next, the slider 112 is slid form the second position to thefirst position. There, the cooperation hook 66 rotates from the unlockposition to the lock position, and engages with the bottom wall 7 a ofthe housing 7. Thereby, the housing 7 is locked undetectably on the restsection 62.

[0103] At the same time, the first to third cogs 111 a to 111 c meshingwith the first to third rack teeth 122 a to 122 c rotate, and the secondheat sink 71 is pushed up from the housing position to the thermalconnection position according to the shape of its end cam 115. Thereby,the contact surface 77 a of the heat receiving convex sections 77 passesthrough the through holes 58 and comes into contact with the heatconductive sheet 35. The heat conductive sheet 35 follows the shape ofthe heat connection surface 34 and the contact surface 77 a and comesinto a close contact with both of them, and connects thermally the firstheat sink 26 with the second heat sink 71.

[0104] When the second heat sink 71 is pushed up to the thermalconnection position, as shown in FIG. 7, the connection terminals 84 ofthe second connector 83 come into contact with the connection terminals37 of the first connector 36 through the connector delivery port 59. Atthe same time, the operation lever 101 of the switch 100 is pressed bythe pressure section 126 of the slider 112, to close the switch 100.

[0105] Thereby, as shown schematically in FIG. 12, the circuit board 16of the portable computer 1 and the electric fan 72 of the cooling module70 are electrically connected. As a result, the power supply, theground, the rotation control signal for keeping the rotation of theimpeller 89 to a fixed value, and the recognition signal for determiningthe coupling state of the cooling apparatus 2 are transmitted/receivedbetween the electric fan 72 and the circuit board 16. The recognitionsignal is a signal for recognizing that the portable computer 1 iscorrectly coupled with the rest section 62 of the cooling apparatus 2.When the portable computer 1 recognizes the completion of coupling withthe cooling apparatus 2 by transmission/reception of the recognitionsignal, the flat motor 96 is supplied with power supply voltage, and theelectric fan 72 shifts to a standby state.

[0106] When the portable computer 1 is coupled with the coolingapparatus 2, if the IC chip 24 of the semiconductor package 23 generatesheat, heat from this IC chip 24 is conducted to the heat receivingportion 28 of the first heat sink 26 through the heat dissipation plate31 and the grease 32. Further, the heat is conducted to the second heatsink 71 of the cooling apparatus 2 from the heat receiving portion 28through the heat conductive sheet 35, and released therefrom.

[0107] When the temperature of the semiconductor package 23 reaches apredetermined value, the electric fan 27 of the cooling unit 25 and theelectric fan 72 of the cooling apparatus 2 start to drive according tothe signal from the circuit board 16. The electric fan 27 built in thehousing 7 delivers air pulled from the first and second suction ports47, 48 as cooling air to the cooling air passage 40 of the first heatsink 26 and the semiconductor package 23 through the discharge port 49.The cooling air cools down the semiconductor package 23, and cools downthe heat exchanging portion 29 of the first heat sink 26 in the courseof flowing through the cooling air passage 40. Much of this cooling airis discharged outside the housing 7 from the cooling air outlet 41.

[0108] The electric fan 72 built in the cooling apparatus 2 delivers airpulled from the first and second suction ports 90, 91 as cooling air tothe cooling air passage 78 of the second heat sink 71. The cooling aircools down the heat exchanging portion 74 in the course of flowingthrough the cooling air passage 78. This cooling air is dischargedoutside the apparatus main body 61 from the cooling air discharge port80 through the cooling air outlet 81.

[0109] Therefore, heat from the semiconductor package 23 conducted tothe second heat sink 71 is released outside the cooling apparatus 2borne by the flow of the cooling air. Moreover, as the first heat sink26 is interposed between the semiconductor package 23 and the secondheat sink 71, the heat capacity of the heat radiation path from thesemiconductor package 23 to the second heat sink 71 is increased.Therefore, the semiconductor package 23 may be cooled down effectively.

[0110] As mentioned above, in a mode of utilization by coupling theportable computer 1 with the cooling apparatus 2, the cooling of thesemiconductor package 23 may be maintained by using the first coolingmodule 70 built in the cooling apparatus 2. As a result, the operationenvironment temperature of the semiconductor package 23 may bemaintained appropriately, by enhancing the cooling performance thereof,and the reliability of the portable computer 1 when operated at fullpower may be improved.

[0111] Next, the procedures for expanding the function of the portablecomputer 1 using the expansion apparatus 3 shall be described.

[0112] When the cooling apparatus 2 is coupled with the portablecomputer 1, first, the slider 112 (see FIG. 10 and FIG. 11) is slid fromthe first position to the second position. This sliding rotates thecooperation hook 66 from the lock position to the unlock position, anddisengages the same from the bottom wall 7 a of the housing 7. Thereby,the second heat sink 71 goes down to the housing position, the thermalconnection with the first heat sink 26 is released, and the connectionterminals 84 of the second connector 83 disengages from the connectionterminals 37 of the first connector 36.

[0113] Therefore, the cooling apparatus 2 may be removed from theportable computer 1 by moving the movable hooks 65 a, 65 b from the lockposition to the unlock position.

[0114] When the removal of the cooling apparatus 2 is completed, thehousing 7 of the portable computer 1 is directed to the rest section 151of the base 150, and the front wall 7 c of the housing 7 is hooked tothe guide projections 156 a, 156 b at the front end of the rest section151. In this state, the housing 7 is rotated downward taking theengagement section of the front wall 7 c and the guide projections 156a, 156 b as a fulcrum, and the housing 7 is overlapped on the restsection 151. Thereby, the lock levers 157 a, 157 b are hooked on thebottom wall 7 a of the housing 7, and the portable computer 1 is lockedon the rest section 151. At the same time, the shutter 19 opens toexpose the first expansion connector 17, and this first expansionconnector 17 and the second expansion connector 155 engage with eachother.

[0115] The engagement of these expansion connectors 17, 155 electricallyconnect the portable computer 1 and the expansion apparatus 3, as shownschematically in FIG. 19. Therefore, the exchange of control signalsbetween both of them is made possible, and expansion elements of theportable computer 1, such as a DVD drive unit 152, may be supported.

[0116] Further, the second expansion connector 155 is electricallyconnected to the electric fan 163 through the circuit board 153 and thecable 185. The cable 185 has a signal line for rotation control tomaintain the rotation of the impeller 177 at a fixed value. The powersupply, the ground, and the rotation control signal aretransmitted/received between the circuit board 16 of the portablecomputer 1 and the electric fan 163, and the electric fan 163 shifts toa standby state.

[0117] When the housing 7 of the portable computer 1 is locked on therest section 151, the heat receiving convex sections 166 of the thirdheat sink 162 comes into contact with the heat conductive sheet 35through the through holes 58 of the cover 56. The heat receiving convexsections 166 are pressed downward by the contact with the heatconductive sheet 35, and by this pressure, the second cooling module 161goes down against the energizing force of the compression coil springs174. Consequently, the heat receiving convex sections 166 areelastically applied to the heat conductive sheet 35 by the compressioncoil springs 174.

[0118] As the result, the heat conductive sheet 35 follows the shape ofthe heat connection surface 34 or the contact surface 166 a and comesinto a close contact with both of them, and thermally connects the firstheat sink 26 and the third heat sink 162.

[0119] When the portable computer 1 is used by coupling with theexpansion apparatus 3, if the IC chip 24 of the semiconductor package 23generates heat, heat from the IC chip 24 is conducted to the heatreceiving portion 28 of the first heat sink 26 through the heatdissipation plate 31 and the grease 32. Further, the heat is conductedto the third heat sink 162 of the expansion apparatus 3 from the heatreceiving portion 28 through the heat conductive sheet 35, and releasedtherefrom.

[0120] When the temperature of the semiconductor package 23 reaches apredetermined value, the electric fan 27 of the cooling unit 25 and theelectric fan 163 of the expansion apparatus 3 start to driverespectively according to the signal from the circuit board 16. Theelectric fan 27 delivers cooling air to the cooling air passage 40 ofthe first heat sink 26 and the semiconductor package 23, and cools downforcibly both of them. The electric fan 163 of the expansion apparatus 3delivers air pulled from the first and second suction ports 178, 179 ascooling air to the cooling air passage 167 of the third heat sink 162.The cooling air cools down the third heat sink 162 in the course offlowing through the cooling air passage 167, and is discharged outsidethe base 150 from the cooling air outlet 168 through the exhaust port169.

[0121] Therefore, heat from the semiconductor package 23 conducted tothe third heat sink 162 is released outside the expansion apparatus 3borne by the flow of the cooling air. Moreover, as the first heat sink26 is interposed between the semiconductor package 23 and the third heatsink 162, the heat capacity of the heat radiation path from thesemiconductor package 23 to the third heat sink 162 is increased.Therefore, the semiconductor package 23 may be cooled down moreeffectively.

[0122] As mentioned above, in a mode of utilization by coupling theportable computer 1 with the expansion apparatus 3, the cooling of thesemiconductor package 23 may be supported by using the second coolingmodule 161 built in the expansion apparatus 3. As a result, theoperational environment temperature of the semiconductor package 23 maybe maintained appropriately by enhancing the cooling performancethereof, and the reliability of the portable computer 1 when operated atfull power may be improved.

[0123] By the way, according to the electronic system of theaforementioned embodiment, in a state where the portable computer 1 iscoupled to a cooling apparatus 2 or an expansion apparatus 3, thepowering of the cooling module 70 of the cooling apparatus 2, the DVDdrive unit 152 of the expansion apparatus 3, or the second coolingmodule 161 may be controlled by the portable computer 1. Therefore, asingle portable computer 1 may support both the cooling apparatus 2 andthe expansion apparatus 3, and the cooling apparatus 2 and the expansionapparatus 3 may be used freely depending on the mode of use of theportable computer 1.

[0124] In addition, as the electric fan 72 built in the coolingapparatus 2 receives power supply voltage or various control signalsfrom the portable computer 1, the electric fan 72 may be controlled andpowered by the portable computer 1. Therefore, it is unnecessary toarrange power supply for powering, or to have circuit components forcontrol of the electric fan 72 in the apparatus main body 61 of thecooling apparatus 2, and this apparatus main body 61 may be formedlighter and smaller than the housing 7 of the portable computer 1.

[0125] Therefore, in a case of adhering to the importance particularlyto the portability of the portable computer 1, it is possible to carrythe portable computer 1 easily, while still maintain a coolingperformance sufficient for utilizing the full capacity of thesemiconductor package 23 by using the cooling apparatus 2 at the sametime.

[0126] Further, since both of the electric fan 72 of the coolingapparatus 2 and the electric fan 163 of the expansion apparatus 3receive a rotation control signal from the portable computer 1, excessrevolutions of the electric fans 72, 163 may be controlled. In short,the electric fans 72, 163 tend to increase the revolutions of theimpeller 89, 177 even when the driving voltage is kept constant,because, in general, the grease adapts itself to the rotating portionsthereof to be lubricated as the operation time elapses. Consequently, ifthe revolutions of the impellers 89, 177 happen to exceed an appropriatevalue, it may cause noise.

[0127] However, according to the aforementioned embodiment, therevolutions of the impeller 89, 177 may be controlled at an appropriatevalue, and the operation noise of the electric fans 72, 163 may bereduced.

[0128] It should be appreciated that the present invention is notlimited to the aforementioned embodiment, but it may be modified withoutdeparting from the scope of the subject matter of the present invention.

[0129] For instance, though in the aforementioned embodiment, the firstand second connectors are built integrally with the first and secondheat sinks respectively, these first and second connectors may also bemounted on the bottom wall of the housing and the apparatus main bodyrespectively.

[0130] Besides, the second and third heat sinks are not necessarilymovable up and down, but they may also be affixed rigidly to the restsection of the cooling apparatus and the expansion apparatusrespectively.

[0131] Moreover, the electrically driven cooling device is not limitedto the electric fan, but it may also be an electric coolant circulationmodule for circulating, for example, a liquid coolant.

[0132] Additional advantages and modifications will readily occur tothose skilled in the art. Therefore, the invention in its broaderaspects is not limited to the specific details and representativeembodiments shown and described herein. Accordingly, variousmodifications may be made without departing from the spirit or scope ofthe general inventive concept as defined by the appended claims andtheir equivalents.

What is claimed is:
 1. An electronic system, comprising: a portableelectronic apparatus having a built-in heat generating component and afirst connector to supply power; and a cooling apparatus detachablycoupled with the portable electronic apparatus to cool said heatgenerating component, the cooling apparatus having a cooling module withan electric fan and being thermally connected to said heat generatingcomponent when coupled to said portable electronic apparatus, and asecond connector connected to said electric fan and connected to saidfirst connector when said cooling apparatus is coupled with saidportable electronic apparatus, wherein the second connector receives thepower from the first connector to supply the power to said electric fan.2. The electronic system according to claim 1, wherein said first andsecond connectors respectively have terminals supplied with a signal tocontrol rotation of said electric fan.
 3. The electronic systemaccording to claim 1, wherein said first and second connectorsrespectively have terminals supplied with a signal to recognize mutualcoupling of said portable electronic apparatus and said coolingapparatus.
 4. The electronic system according to claim 1, wherein saidportable electronic apparatus has a thermal connection section toreceive heat from said heat generating component, and the cooling moduleof said cooling apparatus includes a heat sink thermally connected tosaid thermal connection section that is cooled by said electric fan. 5.An electronic system, comprising: a portable electronic apparatus havinga built-in heat generating component and a first connector to supplypower; and a cooling apparatus detachably coupled with the portableelectronic apparatus to cool said heat generating component, the coolingapparatus having a cooling module with an electrically-driven coolingdevice and being thermally connected to said heat generating componentwhen coupled to said portable electronic apparatus, and a secondconnector electrically connected to said cooling device and connected tosaid first connector when said cooling apparatus is coupled with saidportable electronic apparatus, wherein the second connector receives thepower from the first connector to supply the power to said coolingdevice.
 6. An electronic system, comprising: a portable electronicapparatus having a first heat sink thermally connected to a heatgenerating component, and a first connector to supply power, the firstconnector being attached to the first heat sink; and a cooling apparatusdetachably coupled with the portable electronic apparatus to cool saidheat generating component, the cooling apparatus having a cooling modulewith a second heat sink being thermally connected to said heatgenerating component when coupled to said portable electronic apparatus,an electric fan to provide cooling air to the second heat sink, and asecond connector attached to the second heat sink being connected tosaid first connector when said cooling apparatus is coupled with saidportable electronic apparatus, wherein the second connector receives thepower from the first connector to supply the power to said electric fan.7. The electronic system according to claim 6, wherein said second heatsink is thermally connected to said heat generating component throughsaid first heat sink.
 8. The electronic system according to claim 7,wherein said cooling apparatus has an apparatus main body on which saidportable electronic apparatus rests, said second heat sink is movablebetween a thermal connection position where it is projected from saidapparatus main body and is thermally connected to said first heat sink,and a housing position where it is contained within said apparatus mainbody, and when said second heat sink is moved to the thermal connectionposition, said second connector is electrically connected to said firstconnector, and when said second heat sink is moved to the housingposition, electrical connection between said second connector and saidfirst connector is disengaged.
 9. The electronic system according toclaim 8, wherein said cooling apparatus has an operation mechanism toselectively move said second heat sink to the thermal connectionposition or said housing position, and a switch to close a circuit toconnect said second connector and said electric fan when said secondheat sink is moved to the thermal connection position, and to open saidcircuit when said second heat sink is moved to the housing position, theswitch being opened and closed by said operation mechanism.
 10. Theelectronic system according to claim 6, wherein said first and secondconnectors respectively include terminals to be supplied with a signalto control rotation of said electric fan.
 11. The electronic systemaccording to claim 6, wherein said first and second connectorsrespectively include a terminal to be supplied with a signal torecognize mutual coupling of said portable electronic apparatus and saidcooling apparatus.
 12. An electronic system, comprising: a portableelectronic apparatus having a built-in heat generating component and afirst expansion connector for function expansion, and a first connectorto supply power; a cooling apparatus detachably coupled with saidportable electronic apparatus to cool said heat generating component,the cooling apparatus having a first cooling module with an electric fanand being thermally connected to said heat generating component whencoupled to said portable electronic apparatus, and a second connectorelectrically connected to said electric fan when said cooling apparatusis coupled with said portable electronic apparatus, wherein the secondconnector receives the power from the first connector to supply thepower to said electric fan; and an expansion apparatus detachablycoupled with said portable electronic apparatus in place of said coolingapparatus to expand functionality of the portable electronic apparatus,the expansion apparatus having at least one functional component toexpand the functionality of said portable electronic apparatus, a secondcooling module having a second electric fan and being thermallyconnected to said heat generating component when coupled to saidportable electronic apparatus, and a second expansion connector,electrically connected to said functional component and said secondelectric fan, being connected to said first expansion connector whensaid expansion apparatus is coupled with said portable electronicapparatus.
 13. The electronic apparatus system according to claim 12,wherein said first and second cooling modules each include a heat sinkto be thermally connected to said heat generating component.
 14. Acooling apparatus, detachably coupled with a portable electronicapparatus having a heat generating component and a first connector tosupply power, to cool said heat generating component, comprising: acooling module having an electric fan and being connected to said heatgenerating component when coupled with said portable electronicapparatus; and a second connector, electrically connected to saidelectric fan, being connected to said first connector when coupled withsaid portable electronic apparatus to supply said electric fan with thepower received from the first connector.
 15. The cooling apparatusaccording to claim 14, wherein said cooling module includes a heat sinkthermally connected to said heat generating component when coupled withsaid portable electronic apparatus and is cooled by said electric fan,and said second connector is coupled to said heat sink and exposedoutside the cooling apparatus.
 16. A cooling apparatus, detachablycoupled with a portable electronic apparatus having a heat generatingcomponent and a first connector to supply power, to cool said heatgenerating component, comprising: a cooling module having anelectrically-driven cooling device and being connected to said heatgenerating component when coupled with said portable electronicapparatus; and a second connector electrically connected to said coolingdevice and thermally connected to said first connector when coupled withsaid portable electronic apparatus to supply said cooling device withthe power received from the first connector.
 17. A cooling apparatus,comprising: a cooling module, having an electric fan, adapted to couplewith a portable electronic apparatus having a heat-generating componentand a first connector to supply power; and a second connector,electrically connected to said electric fan, being connected to saidfirst connector when coupled with said portable electronic apparatus tosupply said electric fan with the power received from the firstconnector.
 18. A cooling apparatus, comprising: a cooling module, havingan electrically-driven cooling device, adapted to couple with a portableelectronic apparatus having a heat generating component and a firstconnector to supply power; and a second connector, electricallyconnected to said cooling device, being connected to said firstconnector when coupled with said portable electronic apparatus to supplysaid cooling device with the power received from the first connector.